Sublimation transfer and method

A dry release sublimation transfer comprising a temporary backing sheet, said backing sheet having deposited thereon a sublimation transfer design layer comprised of one or more sublimation transfer inks having a sublimation point between about 100.degree. and 300.degree. C., and a discrete polymeric layer disposed in contact with said design layer, said polymeric layer comprising a polymer having a glass transition temperature within the range of from about -20.degree. C. to about 50.degree. C., a thickness of between about 0.1 and 20 mils, and having a softening point within the transfer range of said sublimation transfer inks, said polymer being selected from the group consisting of copolymers of butyl acrylate and methyl acrylate, acrylonitrilebutadiene-styrene terpolymers, copolymer of vinyl isobutyl ether and methyl methacrylate, copolymers of ethyl acrylate and methyl methacrylate, copolymers of ethyl acrylate and butyl methacrylate, copolymers of vinyl acetate and butyl acrylate, methyl acrylate polymers, copolymers of vinyl chloride and ethylene, copolymers of butyl acrylate and methyl methacrylate, copolymers of butyl acrylate and butyl methacrylate, copolymers of ethylene and vinyl acetate, copolymers of styrene and 1,3-butadiene, copolymers of vinyl isobutyl ether and methyl methacrylate, poly n-butyl methacrylate, poly n-propyl methacrylate, polyethyl methacrylate, polyvinyl chloride, polyacrylonitrile, polystyrene, polymethyl methacrylate, polyethyl acrylate, poly n-propyl acrylate and poly n-butyl acrylate whereby upon the application of said dry release sublimation transfer under heat and pressure to a cotton-containing textile substrate to be decorated, said polymeric layer is adapted to soften and penetrate into said substrate, and said design layer is transferred to said substrate, and upon cooling securely bonds said design layer to said textile substrate.