Hot melt adhesive composition comprising an acidic ethylene polymer and a polyamide

A hot melt adhesive composition comprising a compatible mixture of:

• (a) an acidic polymer of ethylene having an acid number ranging from about 3 to about 80 selected from the group consisting of a terpolymer of ethylene, an ethylenically unsaturated mono- or dicarboxylic acid and a vinyl ester of C.sub.1 to C.sub.6 aliphatic carboxylic acid and a copolymer of ethylene and a C.sub.2 to C.sub.20 aliphatic ester of a mono ethylenically unsaturated mono- or dicarboxylic acid wherein a portion of the carboxylic acid moieties of said mono- or dicarboxylic acid component are not esterified, and (b) a polyamide having an amine number ranging from about 70 to about 400 with a tackifying agent wherein said tackifying agent is present in an amount ranging from about 3 to about 20 parts by weight per 100 parts of (a) and (b) together, components (a) and (b) being present in a relative proportion by weight ranging from about 40:60 to 60:40.