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AssigneeInternational Business Machines Corporation
InventorsJames Kent Howard, Paul Siu-Chung Ho
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A method and resulting structure for forming narrow intermetallic stripes which will carry high currents on bodies such as semiconductors, integrated circuits, magnetic bubbles structures, etc. The conductive stripe includes aluminum or aluminum copper with at least one transition metal. The aluminum and at least one transition metal are deposited onto a supporting body at a very low pressure in a substantially oxygen-free high vacuum. The composite is then annealed at a temperature between about 200.degree. C and 525.degree. C for a time sufficient to form an aluminum and transition metal compound within the aluminum. The conductive stripes are then formed by masking and removing portions of the annealed metallic material. The resulting conductive stripes, which may be of a width of about 6.times.10.sup.-.sup.4 inches or less, have a significantly improved electromigration performance without significantly increasing resistance in the conductive stripe.
A current conductive stripe having minimum physical dimensions and being supported upon a substrate comprising:
An integrated circuit structure comprising a plurality of semiconductor devices electrically connected by means of current conductive stripes which have a minimum physical dimension of less than about 6 .times. 10.sup..sup.-4 inch, said stripes being composed of aluminum and at least one region within the aluminum stripe containing an intermetallic compound of aluminum and a transition metal.
The integrated circuit structure comprising a plurality of semiconductor devices electrically connected by means of current conductive stripes which have a minimum physical dimension of less than about 6 .times. 10.sup..sup.-4 inch, said stripes being composed of aluminum and at least one region within the aluminum stripe containing an intermetallic compound of hafnium and aluminum.
Dependencies are inferred from the claim text.