Thin foil
AssigneeYates Industries, Inc.
InventorsCharles B. Yates, Adam M. Wolski
Life of this patent
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Abstract
A composite foil having an electrolytically formed copper or copper-containing layer and a second electrolytically formed copper layer of a thickness which is not self-supporting, the copper layer and the second metal layer being separated by a coating of a release agent. A process for producing such a composite foil wherein the thin copper layer is formed in a single plating bath containing a copper acid electrolyte. A method for producing copper clad elements suitable for the manufacture of printed circuits from such foils and laminates so produced.
Claims36
A composite foil comprising an electrodeposited copper support layer, a second electrodeposited copper layer of a thickness which is not self-supporting and a thin layer of a release agent intermediate said copper support layer and said second copper layer, said composite foil being capable of being taken up into rolled form.
A composite foil comprising an electrodeposited copper support layer, a second electrodeposited copper layer of a thickness which is not self-supporting and a thin layer of depassivated chromium intermediate said copper support layer and said second copper layer.
A method for forming a composite foil suitable for use in the manufacture of printed circuits comprising electrodepositing a layer of copper in a non-self-supporting thickness on an electrically conductive electrodeposited copper foil carrier which is capable of being taken up into rolled form, the surface of said carrier over which said layer of copper is deposited having a coating of an agent which will permit release of said metal from said carrier without tearing.
A method for forming a composite foil suitable for use in the manufacture of printed circuits comprising electrodepositing a layer of copper in a non-self-supporting thickness on an electrically conductive electrodeposited copper foil carrier, said carrier being capable of being taken up into rolled form, the surface of said carrier over which said layer of copper is deposited having a coating of at least partially depassivated chromium which will permit release of said layer of copper from said carrier without tearing.
Dependencies are inferred from the claim text.