Method of making a liquid phase epitaxial-layers of gallium phosphide on multiple wafers
AssigneeSony Corporation
InventorsNobuyuki Izawa, Kazuya Tanabe
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Abstract
A method of making a liquid phase epitaxial layer of gallium phosphide on each of two semiconductor wafers which are disposed above and below each other in parallel, and at a predetermined distance.
Claims12
A method of making a liquid phase epitaxial layer of gallium phosphide comprising the steps of providing at least two horizontal semiconductor wafers of one conductivity, one of said wafers being substantially parallel to and above the other wafer at a predetermined distance, providing a melt of gallium-gallium phosphide solution, causing said melt to freely flow at least between said semiconductor wafers to fill an area therebetween, and simultaneously growing by cooling said melt on an epitaxial layer of greater thickness on an upper one of said two wafers and lesser thickness on a lower one of said two wafers.
A method of simultaneously making at least two liquid phase epitaxial layers of a gallium compound with substantially differing thickness, comprising the steps of:
- a. providing horizontal upper and lower semiconductor wafers spaced apart by a spacing means, said wafers and spacing means being provided in a tiltable container means;
- b. providing a melt of gallium with a gallium compound and an impurity of given conductivity type diffused therein, a concentration of said gallium compound being higher at an upper surface of said melt and lower at a lower surface of said melt, said melt being positioned adjacent said wafers in said container means;
- c. tilting said container means to freely flow said melt between said wafers;
- and
- d. simultaneously growing by coating an epitaxial layer of greater thickness on said upper layer and an epitaxial layer of lesser thickness on said lower layer due to the concentration difference of said gallium compound.
A method of simultaneously making at least two liquid phase epitaxial layers of a gallium compound with substantially differing thickness, comprising the steps of:
- a. providing horizontal upper and lower semiconductor wafers spaced apart and retained by a holding means;
- b. providing a melt of gallium with a gallium compound and an impurity of given conductivity type diffused therein, said melt being contained in a vessel;
- c. dipping said holding means into said vessel to freely flow said melt between said wafers;
- and
- d. simultaneously growing by cooling an epitaxial layer of greater thickness on said upper layer and an epitaxial layer of lesser thickness on said lower layer.
Dependencies are inferred from the claim text.