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AssigneeHitachi Chemical Company, Ltd.
InventorsKatsushige Tsukada, Asao Isobe, Nobuyuki Hayashi, Masahiro Abo, Ken Ogawa
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A photosensitive resin composition consisting of, or comprising as the essential components, (A) a photo-polymerizable unsaturated compound having at least two terminal ethylene groups, (B) a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (C) a compound containing at least two epoxy groups, and (D) a compound selected from the group consisting of dicyandiamide, p,p'-diaminodiphenyl compounds, polycarboxylic acids having at least two carboxyl groups, polycarboxylic anhydrides and mixtures of the polycarboxylic acids and the polycarboxlic anhydrides. The above photosensitive resin composition can give a protective film excellent in solvent resistance, chemical resistance, heat resistance and mechanical strengths, and hence, can be used in the production of printed circuit boards, precision-processing of metals and as materials for adhesives, paints, plastic relief and the like.
A photosensitive resin composition which consists essentially of (A) 10 to 90% by weight of a photo-polymerizable unsaturated compound containing at least two terminal ethylene groups, (B) 0.1 to 15% by weight of a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (C) 5 to 80% by weight of a compound having at least two epoxy groups and (D) a compound selected from the group consisting of 0.1 to 20% by weight dicyandiamide, 1 to 30% by weight p,p'-diaminodiphenyl compounds, and 0.3 to 1.5 moles per mole of epoxy group of a polycarboxylic acid having at least two carboxyl groups, a polycarboxylic anhydride or mixtures thereof.
A photosensitive resin composition consisting essentially of (A) 10 to 90% by weight of a photo-polymerizable unsaturated compound containing at least two terminal ethylene groups, (B) 0.1 to 15% by weight of a sensitizer capable of initiating said photo-polymerizable unsaturated compound upon irradiation with active rays, (C) 5 to 80% by weight of a compound having at least two epoxy groups and (D) 0.1 to 20% by weight dicyandiamide.
Dependencies are inferred from the claim text.