# US 3,986,653 A · Method for coating bonding tools and product > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 3,986,653 A - Document ID: US3986653A - Status: Granted - Kind: A - Application number: 05/502,537 - Filed: 1974-09-03 - Granted: 1976-10-19 - Earliest claimed: 1974-09-03 - Assignees: Tribotech - Inventors: Denis K. Gilding - Web page: https://patentgrep.com/patent/US3986653A ## CPC - B23K 20/005: {Capillary welding} - C25D 3/50: of platinum group metals - C25D 3/567: {containing more than 50% by weight of platinum group metals} - B23K 2101/36: Electric or electronic devices - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/07532: {Compression bonding, e.g. thermocompression bonding} - H10W 72/07533: {Ultrasonic bonding, e.g. thermosonic bonding} - H10W 72/5522: {comprising gold [Au]} - H10W 72/5524: {comprising aluminium [Al]} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method for the electrodeposition of osmium, ruthenium or their alloys from alkali metal salts of the same in a nonaqueous solvent capable of permitting dissociation of the salt and having low surface tension (e.g., methanol or dimethyl formamide) or mixtures. A silicone layer chemically bonded to the surface of said electrodeposited layer. Also, a bonding tool having a tip coated by either of the above electrodeposited layer or the silicone layer, or both. ## Claims ### Claim 1 A method for the electrodeposition of the hard metal osmium, or alloys thereof comprising the steps of forming an electrolyte solution consisting essentially of a dissociated alkali metal salt of a complex of osmium as the anion in a nonaqueous organic solvent capable of dissolving said salt in ionized form and electrolytically depositing the hard metal from the solution onto a plating substrate comprising the cathode, said organic solvent consisting essentially of a major portion of aprotic solvent and a minor portion of lower alcohol. ### Claim 2 (depends on 1) A method as in claim 1 in which the substrate consists essentially of a metal-containing material selected from the group consisting of tungsten, tungsten carbide, tungsten steel, tool steel, rhenium, platinum, rhodium, molybdenum, titanium, hafnium, zirconium, tantalum, gold, silver, nickel, cobalt, copper, niobium, aluminum, alumina, and alloys thereof. ### Claim 3 (depends on 1) A method as in claim 1 in which the hard metal is deposited as an alloy with a compatible metal selected from the group consisting of rhodium, iridium, palladium, platinum and gold. ### Claim 4 (depends on 1) A method as in claim 1 in which the hard metal complex of the alkali metal salt is osmium pentoxide. ### Claim 5 (depends on 1) A method as in claim 1 in which the organic solvent is characterized by a surface tension substantially below that of water. ### Claim 6 (depends on 1) A method as in claim 1 in which the lower alcohols are selected from the group consisting of methanol and ethanol. ### Claim 7 (depends on 1) A method as in claim 1 in which the aprotic solvent is selected from the group consisting of dimethyl formamide, dimethyl sulphoxide, dimethyl acetamide, and combinations of the same. ### Claim 8 (depends on 1) A method as in claim 1 in which the alkali metal salt is selected from the group consisting of sodium, lithium and potassium. ### Claim 9 (depends on 1) A method as in claim 1 in which the alkali metal salt is formed by mixing the alkali metal with an ionizable salt of the hard metal. ### Claim 10 (depends on 9) A method as in claim 9 in which the alkali metal salt is formed in a portion of the organic solvent comprising a lower alcohol, and thereafter the remainder of the organic solvent comprising aprotic solvent is added prior to electrolytic deposition. ### Claim 11 (depends on 9) A method as in claim 9 in which the ionizable salt comprises osmium tetroxide. ### Claim 12 (depends on 3) A method as in claim 3 in which the alloy comprises said hard metal and platinum. ### Claim 13 (depends on 1) A method as in claim 1 in which the plating substrate is the surface of a microstructural bonding tool for holding a bonding wire against a surface to which the wire is to be bonded during application of energy thereto, which tool comprises an elongate tool body having a wire guide opening and a bonding surface at the end thereof. ### Claim 14 (depends on 1) A method as in claim 1 in which a silicone layer is deposited onto the surface of the electrolytically deposited hard metal substrate. ### Claim 15 (depends on 14) A method as in claim 14 in which the silicone layer is formed by treating the surface of the hard metal substrate to form pendant groups of the general formula --OM wherein M is hydrogen or a cation having a valence of one and contacting the treated surface with a silane of the general formula (R).sub.n Si(X).sub.4.sub.-n wherein n varies from 0 to 3, R is an aliphatic or aromatic group and X is a halogen group or alkoxy radical. ### Claim 16 (depends on 15) A method as in claim 15 in which the --OM groups are formed by electrolytically reacting the hard metal surface with a base. ### Claim 17 (depends on 16) A method as in claim 16 in which the base-reacted surface is washed with an acid to form hydroxyl groups before contact with the silane. ### Claim 18 (depends on 15) A method as in claim 15 in which the silane is selected from the group consisting of dimethyl dichlorosilane, dimethyl diethoxysilane, trimethyl chlorosilane, and trimethyl ethoxysilane. ### Claim 19 An electrolytic solution for depositing the hard metal osmium onto a substrate, said solution consisting essentially of a dissociated alkali metal salt of an oxide complex of osmium in a nonaqueous organic solvent consisting essentially of a major portion of aprotic solvent and a minor portion of a lower alcohol. ### Claim 20 (depends on 19) An electrolytic solution as in claim 19 together with a dissociated alkali metal salt of a complex of a hard metal compatible alloying metal selected from the group consisting of rhodium, iridium, palladium, platinum and gold. ### Claim 21 (depends on 19) A solution as in claim 19 in which the hard metal is osmium and the hard metal ion of the alkali metal salt is osmium pentoxide. ### Claim 22 (depends on 19) A solution as in claim 19 in which the organic solvent is characterized by a surface tension substantially lower than that of water. ### Claim 23 (depends on 19) A solution as in claim 19 in which the organic solvent is selected from the group consisting of lower alcohols, aprotic solvents and mixtures thereof. ### Claim 24 (depends on 19) A solution as in claim 19 in which the aprotic solvent is selected from the group consisting of dimethyl formamide, dimethyl sulphoxide, dimethyl acetamide, and combinations of the same. ### Claim 25 (depends on 1) An electroplated substrate formed by the process of claim 1. ### Claim 26 In a microstructural bonding tool for holding a bonding wire against a surface to which the wire is to be bonded during application of energy thereto, which tool comprises an elongate tool body having wire guide means and a bonding surface at the end thereof, a layer on said tool of electrodeposited hard metal selected from the group consisting of osmium, ruthenium or alloys of the same, said layer being characterized by a grain size less than 15 microinches. ### Claim 27 (depends on 26) An article as in claim 26 in which the layer is an alloy of the hard metal with a compatible metal selected from the group consisting of rhodium, iridium, palladium, platinum and gold. ### Claim 28 (depends on 26) An article as in claim 26 in which the layer is an alloy in intimate dispersion. ### Claim 29 (depends on 28) An article as in claim 28 in which the layer is an osmium-platinum alloy. ### Claim 30 (depends on 26) An article as in claim 26 in which a silicone layer is bonded to the electrodeposited hard metal layer surface.