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AssigneeHitachi, Ltd.
InventorsHitoshi Yokono, Shunichi Numata, Kazuo Goto, Masahiko Sakai, Toshikazu Narahara, Junji Mukai
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Thermosetting resin compositions are obtained by mixing a resinous addition product produced by reacting an isocyanate compound having a molecular weight of 100 to 2000 and containing at least two isocyanate groups in its molecule with an epoxyphenol compound represented by the formula, ##EQU1## wherein R is a bi- or more valent group containing phenyl, R.sub.1 is hydrogen, methyl or ethyl, m and n each are an integer of 1-8, and optionally an ordinary thermosetting epoxy resin, and 0.01 to 10 % by weight of a basic heterocycle forming catalyst based on the weight of said resinous addition product, said isocyanate compound and said epoxyphenol compound being blended so that said OH group may be present in an amount of 1/3 to 1 equivalent per equivalent of said isocyanate group and said epoxy group may be present in an amount of one-fifth to two-thirds equivalent per equivalent of said isocyanate group. The said addition product can be converted into a stable B-stage and is particularly useful as a varnish for prepreg.
A thermosetting resin composition comprising a reaction product of an isocyanate compound having a molecular weight of 100 to 2000 and containing at least two isocyanate groups in its molecule with an epoxyphenol compound which is represented by the formula, ##EQU2## wherein R is a bi- or more valent group containing phenyl, R.sub.1 is hydrogen, methyl or ethyl, m and n each are an integer of 1-8, and 0.01 to 10% by weight of a catalyst which forms an isocyanurate bond and an oxazolidone bond on curing, based on the weight of said reaction product, said isocyanate compound and said epoxyphenol compound being blended so that said OH group may be present in an amount of 1/3 to 1 equivalent per equivalent of said isocyanate group and said epoxy group may be present in an amount of one-fifth to two-thirds equivalent per equivalent of said isocyanate group and the resulting blend being heated to effect masking of at least part of the NCO groups and thereby form said reaction product.
A B-stage resin composition obtained by partially curing a thermosetting resin composition to form a resin composition having no three-dimensional structure, said thermosetting resin composition comprising a reaction product of an isocyanate compound having a molecular weight of 100 to 2000 and containing at least two isocyanate groups in its molecule with an epoxyphenol compound which is represented by the formula, ##STR3## wherein R is a bi- or more valent group containing phenyl, R.sub.1 is hydrogen, methyl or ethyl, m and n each are an integer of 1-8, and 0.01 to 10% by weight of catalyst which forms an isocyanurate bond and an oxazolidone bond on curing, based on the weight of said reaction product, said isocyanate compound and said epoxyphenol compound being blended so that said OH group may be present in an amount of 1/3 to 1 equivalent per equivalent of said isocyanate group and said epoxy group may be present in an amount of one-half to two-thirds equivalent per equivalent of said isocyanate group and the resulting blend being heated to effect masking of at least part of the NCO groups and thereby form said reaction product.
Dependencies are inferred from the claim text.