Semiconductor wafer dicing fixture

Apparatus for holding a semiconductor wafer in a predetermined position to permit dicing of the wafer into discrete semiconductor chips of a predetermined size without dislocation of said chips during the dicing operation, said chips being arranged in the wafer with a kerf area intermediate adjacent chips;

• said apparatus comprising:
• a base member having means defining a semiconductor wafer receiving areas;
• means connected to said base member for applying a vacuum thereto;
• a plurality of spaced apart apertures in said wafer receiving area and extending into said base member to provide fluid communication with said means for applying a vacuum to said base member;
• said apertures being positioned in said wafer positioning area so that at least one aperture underlies each individual chip to be diced from said wafer;
• a cover plate having a plurality of interdigitaged ribs and slots, said slots extending through said cover and dimensioned for alignment with the kerfs of said chips;
• at least the portion of said rib in confronting relation to said semiconductor wafer receiving area including a resilient compressible material, said resilient compressible material adapted for superimposed pressing relation on a wafer so that when a wafer is being cut through said slots, the vacuum being drawn coupled with the pressing engagement of the ribs on said wafer inhibit dislocation of said chips during a dicing operation.