Method for making high density magnetic bubble domain system

A method for making a high-density magnetic bubble domain chip, comprising the steps of:

• depositing a first layer of metallic material on a substrate comprised of a magnetic medium in which said bubble domains can exist,
• forming a patterned layer of resist on said metallic material which exposes said first metallic layer in selected portions thereof,
• depositing a second metallic layer on said exposed portions of said first metallic layer,
• removing said resist layer,
• ion implanting said magnetic bubble domain medium to produce propagation elements therein, said ion implantation occurring in regions of said magnetic medium not covered by said second metallic layer,
• removing said second metallic layer and removing said first metallic layer except in those regions which had said second matallic layer thereon,
• forming a patterned second layer of resist which exposes at least one portion of said substrate, and
• depositing a third metallic layer onto said at least one exposed portion of said substrate.

A method of fabricating a high-density magnetic bubble domain chip, comprising the steps of:

• forming a thin layer of magnetically soft material on a substrate including a magnetic medium in which said bubble domains can be moved,
• forming a layer of masking material on said thin layer of magnetically soft material,
• patterning said layer of masking material and said thin layer of magnetically soft material to form an ion implantation mask having contiguous elements of said thin layer therein,
• ion implanting regions of said magnetic medium surrounding said contiguous elements to form ion implanted bubble domain propagation elements which are contiguous with one another,
• removing said layer of masking material from said contiguous elements of magnetically soft material to leave a structure comprising said magnetic medium having ion implanted regions therein and said contiguous elements of magnetically soft material,
• masking said structure to define locations which are to receive a non-magnetic metallization layer,
• depositing said metallization layer to provide electrical conductors on said magnetic chip.