Heat bonding device

A device for bonding heat bondable materials in a desired seam configuration which comprises:

• pressure chamber means having a cavity enclosed by a deflectable diaphragm, the cavity defining a first area;
• support means in opposing relation to said diaphragm, said support means being at least coextensive with said cavity;
• means for moving said pressure chamber and said support means relative to each other between a first position wherein said diaphragm and said support means are spaced from each other and a second position wherein said diaphragm is fully supported by said support means;
• means for controlling the pressure in said pressure chamber means including means for deflecting said diaphragm with a pressure chamber means pressure above ambient pressure when said pressure chamber means and support means are in said first position and means for increasing the pressure in said pressure chamber means to a desired bonding pressure when said pressure chamber means and support means are in said second position, said deflected diahragm progressively expelling air trapped within said materials during movement from said first position to said second position;
• and
• heat generating means in intimate contact with said diaphragm and having a configuration conforming to the desired seam configuration for applying bonding heat to the area of the desired seam configuration, the area of the desired seam configuration being small relative to said first area.

In a device for bonding heat bondable materials in a desired seam configuration of the type having means for supporting the material, having means cooperating with said supporting means for applying pressure to the material and having means for applying heat to the material, the improvement which comprises:

• said pressure applying means comprising means for applying a uniform pressure over a first area of the supported material, said first area including the area of the desired seam configuration and being large relative thereto, said pressure applying means and said material supporting means each including a diaphragm in opposing relation to each other and spanning said first area;
• said heat applying means comprising heat generating means in intimate contact with said diaphragm and having a configuration conforming to the desired seam configuration for applying bonding heat to the area of the desired seam configuration of said material through said diaphragm;
• and
• means for selectively removing heat from said heat applying means including refrigerated means.

A device for bonding heat bondable materials in a desired seam configuration through the application of heat and pressure which comprises:

• means for supporting the material to be seamed;
• means for applying a uniform pressure to a first area of the supported material, said first area including the area of the desired seam configuration and being large relative thereto and said pressure applying means including pressure chamber means having a cavity enclosed by a deflectable diaphragm with the diaphragm being in opposing relation to said material supporting means and the expanse of said cavity defining said first area;
• and
• heat generating means in intimate contact with said diaphragm within said pressure chamber means and having a configuration conforming to the desired seam configuration for applying bonding heat to the area of the desired seam configuration of said material through said diaphragm.