Back to results
US 3,964,087 AGranted
Resistor network for integrated circuit
AssigneeInterdyne Company
InventorMarvin C. Mallon
Life of this patent
Estimating the term…
Abstract
An electrical resistance package comprises: A. an insulative substrate, B. a network in film form on the substrate, the network including resistance branches, C. there being terminals on the substrate and associated with the respective branches for registration with contact pins, whereby the resistance branch may be selectively electrically connected via said terminals with the pins in registration therewith.
Claims14
An electrical resistance package comprising
- a. an insulative substrate,
- b. a network in film form on the substrate, the network including resistance branches,
- c. there being terminals on the substrate and associated with the respective branches for registration with contact pins, whereby the resistance branches may be selectively electrically connected via said terminals with the pins in registration therewith, said terminals comprising electrically conductive pads located at the ends of the branches, the substrate forming edge notches to receive the pins and each pad extending proximate a notch edge but everywhere offset therefrom away from the notch edge so as to remain out of direct contact with the pin in the notch, whereby means may be received on selected pins to closely overlie selected pads and to have soldered connections to the selected pins and pads.
Dependencies are inferred from the claim text.