Heat dispersion device for use in an electronic apparatus
AssigneeSony Corporation
InventorsTadao Suzuki, Hirohito Kawada, Yasuo Sugimoto
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AssigneeSony Corporation
InventorsTadao Suzuki, Hirohito Kawada, Yasuo Sugimoto
Estimating the term…
A heat dispersion device for use in an apparatus having at least one heat-generating electronic element, such as, a power transistor, includes a thermally conductive heat dispersion member having a portion on which the heat-generating electronic element is mounted and a set of fins defining channels therebetween opening at the top and bottom of the set of fins, and a duct extending upwardly from the set of fins and communicating with the channels between the latter so that the generated heat is dispersed to air flowing upwardly in the channels and the heated air is conducted upwardly in the duct away from the heat dispersion member. For maximum effectiveness, the distance from the bottom of the set of fins to the top of the duct is made at least twice as large as the distance between the top and bottom of the set of fins. Further, the heat dispersion device may include a plurality of heat dispersion members, as aforesaid, assembled together with one or more ducts to provide a required heat dispersing capacity.
A heat dispersion device, comprising at least one heat dispersion member of heat conducting material including a first portion for receiving at least one heat-generating electronic element thereon and a second portion connected to said first portion and having at least one set of spaced apart fins defining channels therebetween which open at the top and bottom of said set of fins, said fins being positioned parallel to each other and uniformly spaced apart in the range between 5mm and 10mm;
Dependencies are inferred from the claim text.