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US 3,960,984 AGranted
Composition of oxymethylene polymer and amide oligomers
AssigneeE. I. Du Pont de Nemours and Company
InventorMelvin Ira Kohan
Life of this patent
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Abstract
A composition with high thermal stability possessing superior resistance to mold and die deposits comprises (A) an oxymethylene homopolymer or copolymer and (B) 0.01 to 10% by weight of an amide oligomer having a molecular weight of 800 to 10,000 and wherein the active ends (based upon either amine or acid terminal groups) of the oligomer constitute no more than 0.02 mole % of the formaldehyde segments in the oxymethylene polymer.
Claims19
A composition of matter comprising
- A. 90% to 99.99% by weight of an oxymethylene homopolymer or copolymer comprised of at least 60% by weight of oxymethylene segments, and
- B. 10 to 0.01% by weight a dicapped amide oligomer having a molecular weight of between 800 to 10,000 wherein the active ends of said oligomer constitute no more than 0.02 mole percent of the formaldehyde segments in said homopolymer or copolymer.
Dependencies are inferred from the claim text.