High power thick film circuit with overlapping lead frame

In a thick film electrical circuit including an insulating face plate and thick film conductors adhering to one surface of said face plate, the improvement wherein there are electrically conductive external leads which are of substantially greater thickness than the thick film conductors and which have integral inwardly extending strip portions of said greater thickness and of low thermal resistance, some of said strip portions overlying selected thick film conductors in electrical contact therewith and in laminated relationship to substantially increase the current carrying capacity thereof, and at least one heat generating semi-conductor component mounted directly on an inwardly extending strip portion from said external leads whereby one contact of said semi-conductor component is electrically connected to said strip portion by said mounting, said last mentioned strip portion being of greater area than other strip portions and of greater area than said semi-conductor component thereon, and the laminated relationship of said last mentioned strip portion on the thick film conductor portion therebelow providing for lateral thermal heat diffusion from said component into said strip portion whereby heat diffusion through the insulating face plate occurs over a substantially greater area than the area occupied by the heat generating component, and means electrically connecting another contact of said semi-conductor to another strip portion.