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US 3,956,814 AGranted
Process of making lids for microelectronic circuit gases
AssigneeBliss & Laughlin Ind., Inc.
InventorRobert L. Peet
Life of this patent
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Abstract
A process for forming stepped lids for microelectronic circuit cases. A plurality of interconnected lids is etched in a metal sheet with the lids oversize. Individual lids are stamped from the sheet to the desired size, providing substantially square corners at the edge of the lid and a substantially flat rim for engagement with the case.
Claims4
A process for making lids of predetermined length and width for microelectronic circuit cases and the like, including the steps of:
- masking a metal sheet in a pattern of a plurality of interconnected lids of length and width greater than said predetermined length and width;
- etching the sheet to produce the plurality of interconnected lids with a thicker central portion and a thinner rim portion;
- removing the masking material;
- and
- cutting individual lids from the sheet in a stamping operation trimming the lid to the predetermined length and width providing substantially square corners at the edge of the lid.
2 more elements
Dependencies are inferred from the claim text.