Hot-melt pressure-sensitive adhesive

Abstract

A solvent-free pressure-sensitive hot-melt adhesive contains: A. a block copolymer having the general configuration A--B--A wherein A is a polymer block of vinyl arene and B is a polymer block of conjugated diene, B. a tackifying resin system, C. a naphthenic process oil plasticizer having a naphthenic content between 52% and 75% and less than 5% aromatic by total carbon types of the process oil, D. a curing agent, E. a filler, and F. an antioxidant. The hot-melt adhesive described above can be applied to a number of backings without the use of solvents. The adhesive is rendered fluid by the use of heat and mechanical working. Adhesive tape made using the hot melt of the present formulation has all of the advantages inherent in the prior art tapes based upon solvent applied adhesives. The use of the hot-melt adhesive described above prevents air pollution which was inherent in the solvent removal step necessary in the prior art use of solvent based adhesive systems. In addition, it also raises the production rate which in the prior art was limited by the polymer dissolution rate and by the rate of evaporation of the solvent carrier.

Dependencies are inferred from the claim text.