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US 3,954,570 AGranted
Sensitized polyimides and circuit elements thereof
AssigneeAMP Incorporated
InventorsAlbert Shirk, Myron Ceresa
Life of this patent
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Abstract
A process for preparation of an activated or sensitized polyimide polymer, deposition of various catalysts on the sensitized polymer and subsequent plating on said sensitized and catalyzed surface of a metal, e. g., nickel, cobalt, copper, or gold from an electroless bath; improved adhesion, avoidance of blistering, etc. are observed; the process is capable of producing useful printed circuits such as for mounting integrated circuit chips.
Claims15
A process for depositing an electroless metal on a polyimide, the steps comprising:
- a. masking a selected area on a polyimide surface;
- b. exposing unmasked portions of said polyimide surface to an open flame;
- c. contacting said unmasked and flame sensitized surfaces of said polyimide with a catalyst solution whereby a catalytic amount of a catalyst is deposited on said catalyzed polyimide;
- and
- d. depositing on said catalyzed polyimide surface a metal from an electroless bath solution.
2 more elements
Dependencies are inferred from the claim text.