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AssigneeKulite Semiconductor Products, Inc.
InventorsAnthony D. Kurtz, Joseph R. Mallon, Harold Bernstein, Richard Alan Weber
Estimating the term…
A glass or other dielectric backed transducer structure is formed by utilizing a series of processes including at least one electrostatic bond. The processes enable one to bond a semiconductor wafer to a dielectric as a glass wafer. Then by selectively removing certain conductively semiconductor, one obtains a "thin ribbon" piezoresistive bridge secured to a thin glass wafer. The resultant structure is entirely unanticipated by the prior art. A glass part is also formed by electrostatically bonding a glass wafer to a semiconductor wafer, polishing the glass to a desired depth, masking the polished glass layer according to a desired pattern representative of the glass part, etching away all the glass except the desired pattern, and thence removing all the semiconductor.
A method of fabricating a transducer assembly on a glass dielectric wafer, comprising the steps of:
A method of fabricating a glass part of a desired geometrical configuration, comprising the steps of:
A method of fabricating a glass part comprising the steps of:
A method of fabricating a glass-backed transducer comprising the steps of:
Dependencies are inferred from the claim text.