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US 3,949,118 AGranted
Process for soldering difficultly solderable material having oxide surface and a solder alloy therefor
AssigneeAsahi Glass Company, Limited
InventorsKentaro Nagano, Kohji Nomaki, Yoshihito Saoyama
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Abstract
Difficultly solderable material having an oxide surface such as glass, ceramics or such metals as Si, Ge, Al, Ti, Zr or Ta is soldered using a solder alloy composed of 2-98.5% by wt. of Pb, 1-97.5% by wt. of Sn and 0.1-15% by wt. of rare earth metals, while applying vibration, preferably of the ultrasonic type.
Claims4
A process for applying a solder to a difficultly solderable material having an oxide surface comprising:
- heating a solder spatula to about 250.degree.-450.degree.C,
- preheating the oxide surface to about 100.degree.-200.degree.C before the soldering operation,
- contacting the difficultly solderable material with a solder consisting essentially of 40-98 wt. % of Pb;
- 2-50 wt. % of Sn;
- 1-4 wt. % of at least a metal selected from the rare earth metals;
- 0-10 wt. % of Zn;
- 0.05-10 wt. % of Sb;
- 0-0.01 wt. % of Al;
- and 0-0.5 wt. % of at least one metal selected from the group consisting of Si, Ti and Be,
- contacting the solder with the solder spatula,
- vibrating ultrasonically the solder spatula so that the activity of the oxide surface is improved and a strong bond is formed between the solder and the oxide surface.
8 more elements
A process for applying a solder to a difficultly solderable material having an oxide surface comprising:
- heating a solder spatula to about 250.degree.-450.degree.C,
- preheating the oxide surface to about 100.degree.-200.degree.C before the soldering operation,
- contacting the difficultly solderable material with a solder consisting essentially of 20-50 wt. % of Pb;
- 50-98 wt. % of Sn;
- 1-4 wt. % of at least a metal selected from the rare earth metals;
- 0-10 wt. % of Zn;
- 0.05-10 wt. % of Sb;
- 0-0.01 wt. % of Al;
- and 0-0.5 wt. % of at least one metal selected from the group consisting of Si, Ti and Be,
- contacting the solder with the solder spatula,
- vibrating ultrasonically the solder spatula so that the activity of the oxide surface is improved and a strong bond is formed between the solder and the oxide surface.
8 more elements
Dependencies are inferred from the claim text.