Island assembly employing cooling means for high density integrated circuit packaging

A packaging system for electronic equipment comprising at least one island, said island including

• a plurality of integrated circuit packages, each package having a plurality of electrical conductors and a heat sink member with integral extensions at its opposite extremes,
• connector means mounting said packages,
• an interconnection medium having a plurality of conductive pads,
• each of said connector means having a plurality of electrical contacts and being operatively connected in predetermined relationship to said interconnection medium and providing respective electrical paths between said integrated circuit package electrical conductors and said interconnection medium conductive pads, and
• a cooling frame fastened to said interconnection medium on the same side thereof as said conductive pads, said cooling frame being configured such that a plurality of sections of thermally conductive material are situated in parallel spaced-apart relationship across the surface of said interconnection medium, each of said connector means being located in the space between an adjacent pair of said cooling frame sections, the heat sink member of each integrated circuit package mounted in said connector means straddling said means such that said integral extensions contact respectively said last mentioned pair of cooling frame sections.