Wire bond integrity tester

A wire bond integrity tester connected to a source of low pressure for testing the bond which attaches a fine wire to a microelectronic module, said tester comprising in combination:

• a. a base, said base including a manifold in fluid communication with the source of low pressure;
• b. a platform mounted upon said base for supporting the module, said base including a chamber in fluid communication with said module for applying low pressure to the lower surface of the module, whereby, the pressure difference between the low pressure and ambient pressure retains the module in place;
• c. a pedestal mounted upon said base for housing a piston within a cylinder, said piston being axially movable in response to change in air pressure within said cylinder;
• d. air flow regulating means disposed intermediate said cylinder and said manifold for controlling the axial movement of said piston by regulating the flow of air between said cylinder and said manifold;
• e. a pivotable arm mounted above said base for interconnecting said piston with the fine wire, said arm applying a force to the fine wire in proportion to the axial movement of said piston, said arm having gauge means for recording the force applied to the fine wire;
• and
• f. a normally open vent valve for venting said manifold to ambient air pressure and relieving the force applied to the module and the fine wire;
• whereby, on closure of said valve a force is applied to retain the module in place and a regulated and recorded test force is applied to the fire wire while maintaining the capability of instantly and simultaneously relieving the module retaining force and the test force applied to the fine wire.