Hollow cavity package electronic unit

A method of fabricating a package for housing an electronic unit in a cavity within said package comprising the steps of:

• :
• a. mounting said electronic unit on a lower portion of said package;
• b. applying a fibrous sheet, selected from the group consisting of non-woven polyester fabric, glass paper and Japanese wooden paper, impregnated with a partially cured plastic polymer to a mating surface of the lower portion, said plastic polymer being selected from the group consisting of epoxide resin polymers, unsaturated polyester resin polymers, pheral resin polymers and melamine resin polymers;
• c. placing the externallead wires onto the fibrous sheet so as to bond them to the lower portion;
• d. connecting internal lead wire between said external lead wires and said electronic unit;
• e. applying a partially cured plastic polymer adhesive to a mating surface of an upper portion of said package, said upper portion having an aperture therein;
• f. bringing the mating surface of the upper portion into contact with a corresponding mating surface on said lower portion;
• g. applying a pressure to said upper and lower portions so as to maintain their contact;
• h. heating said package to fully cure the plastic polymer adhesive;
• and
• i. sealing said aperture in said upper portion of the package.