Mechanical structure for mounting microwave diode packages

An apparatus for mounting a device in a stripline circuit of the type having a dielectric substrate with a ground plane conductor on one face of the substrate and a narrow strip-like conductor on the opposite face of the substrate, said circuit having an aperture for receiving said device in a position to allow for electrical connections to said strip-like conductor, comprising:

• a. a first block of electrically and thermally conductive material mounted in contiguous relation with said ground plane to provide an electrical ground to said circuit and to conduct heat from said circuit, said first block having an opening for receiving a second block, said opening being aligned with said aperture and defined by a plurality of surfaces formed in said first block,
• b. said second block being formed of electrically and thermally conductive material and including a surface portion for mounting said device, and further including a plurality of additional surfaces adapted to mate substantially with the surfaces of said opening,
• said device being mounted on said surface portion of said second block and having one terminal of said device being electrically and thermally connected to said second block mounting surface portion,
• c. means for forcing said second block into close mating relation with said first block whereby said mating surfaces of said second block are pressed into good thermal and electrical contact with the corresponding surfaces of said opening in said first block,
• d. said forcing means including an adjustable force producing member adapted to apply a force to one surface of said second block to adjustably force said second block into said first block along two major axes of the respective blocks, the angle of said force relative to said one surface being an acute angle.