Method of sealing adjoining parts of an evacuated vessel with solder glass
AssigneeU.S. Philips Corporation
InventorsCoenraad Maria La Grouw, Cornelus Wilhelmus Theresia Van Den Wittenboer, Hendrik Jan Hubers
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Abstract
Parts of an evacuated glass vessel are joined by a noncrystallizing solder glass having a coefficient of thermal expansion which is higher than that of the surfaces to be sealed and which contains particles of glass which reduces the coefficient of thermal expansion without increasing the soldering temperature, e.g. a boro-silicate, aluminosilicate or quartz glass having a thermal coefficient of expansion smaller than 40 .times. 10.sup..sup.-7.
Claims3
A resultant solder glass for joining abutting surfaces of parts of an evacuated vessel consisting essentially of a basic non-crystallizing solder glass having a coefficient of thermal expansion which is higher than that of the material of the surfaces to be joined admixed with a comminuted glass having a coefficient thermal expansion less than 40 .times. 10.sup..sup.-7 for increasing the stress build-up temperature of the basic non-crystallizing solder glass, said resultant solder glass having a coefficient of thermal expansion which corresponds to that of the material of the surfaces to be joined, said basic glass consisting essentially of:
- 70 - 85% by weight of PbO
- 10 - 21% by weight of B.sub.2 O.sub.3
- 0 - 4.5% by weight of ZnO
- 0 - 10% by weight of Al.sub.2 O.sub.3
- 0 - 4.5% by weight of SiO.sub.2
- 0 - 0.6% by weight of CoO
- having admixed therewith a quartz glass, a borosilicate glass or an aluminosilicate glass.
A resultant solder glass for joining abutting surfaces of parts of an evacuated vessel consisting essentially of a basic non-crystallizing solder glass having a coefficient of thermal expansion which is higher than that of the material of the surfaces to be joined admixed with a comminuted glass having a coefficient of thermal expansion less than 40 .times. 10.sup..sup.-7 for increasing the stress build-up temperature of the basic non-crystallizing solder glass, said resultant solder glass having a coefficient of thermal expansion which corresponds to that of the material of the surfaces to be joined, said basic glass consisting essentially of:
- 78% by weight of PbO
- 15.3% by weight of B.sub.2 O.sub.3
- 3.5% by weight of SiO.sub.2
- 2.7% by weight of Al.sub.2 O.sub.3 and
- 0.5% by weight of CoO
- admixed
- with 6.6% by weight of quartz glass
- and 3.3% by weight of Al.sub.2 O.sub.3.
A resultant solder glass for joining abutting surfaces of parts of an evacuated vessel consisting essentially of a basic non-crystallizing solder glass having a coefficient of thermal expansion which is higher than that of the material of the surfaces to be joined admixed with a comminuted glass having a coefficient of thermal expansion less than 40 .times. 10.sup..sup.-7 for increasing the stress build-up temperature of the basic non-crystallizing solder glass, said resultant solder glass having a coefficient of thermal expansion which corresponds to that of the material of the surfaces to be joined said basic glass consisting essentially of:
- 79.5% by weight of PbO
- 10% by weight of B.sub.2 O.sub.3
- 10% by weight of Al.sub.2 O.sub.3
- 0.5% by weight of CoO
- admixed with
- 7% by weight of the basic solder glass of a glass
- having a composition
- 78% by weight of SiO.sub.2
- 5% by weight of alkali oxides
- 15% by weight of B.sub.2 O.sub.3 and
- 2% by weight of Al.sub.2 O.sub.3.
Dependencies are inferred from the claim text.