Apparatus for carrying out bonding at programmed positions of a circuit element and at corrected positions of leads therefor

Apparatus for electrically connecting a plurality of electrodes of an electronic circuit element and a plurality of leads arranged in a predetermined geometric configuration on a lead frame, including a rotatable work stage on which the lead frame is placed with the circuit element mounted on the lead frame, a bonding tool movable with respect to said work state, driving means for driving said bonding tool relative to said work stage with reference to positions of the electrodes and leads, and azimuthal means for rotating said work stage to align the circuit element in a predetermined direction, said azimuthal means thereby producing an electric signal representative of an azimuthal error, wherein the improvement comprises:

• translational means for translating the bonding tool relative to said work stage after the circuit element is aligned in the predetermined direction to place said bonding tool at a predetermined position relative to the circuit element, the translational means thereby producing an electric signal representative of a positional error;
• and
• the driving means including calculating means responsive to the positions of the leads and the azimuthal and positional errors for electrically calculating relative positions of the leads, and means responsive to the positions of the electrodes and the relative positions of the leads for driving the bonding tool to carry out the bonding process, said calculating means comprising first means for converting said azimuthal error into components in the directions of orthogonal rectilinear coordinate axes and second means responsive to the calculating means components, the positions of the leads, and the positional error for electrially calculating the relative positions.