Method of bonding a thermoplastic resinous protective coating to a metallic substrate
AssigneeColorguard Corporation
InventorGlen E. Ingraham
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Abstract
A metallic substrate, such illustratively as wire, to which is bonded by means of a resinous hot melt adhesive and in a continuous operation a thermoplastic resinous coating. The method of making the coated metallic substrate comprises applying a resinous hot melt adhesive about the metallic substrate and thereafter extruding a molten thermoplastic resin onto the deposited adhesive at high rates of speed.
Claims15
A continuous process for applying a protective coating to a clean metallic substrate and simultaneously bonding said coating thereto that comprises applying, in a first treatment zone, to a rapidly advancing length of said substrate a first ply of molten hydropholic hot melt adhesive composition composed of a non-thermosetting phenolic-modified terpene resin and ethylene-vinyl acetate copolymer at a temperature of from about 200.degree.F to 450.degree.F to effect a bonding of said adhesive to said metallic substrate;
- advancing said adhesive coated substrate to a second treatment zone wherein said adhesive is cooled to a solid, soft, flow-resistant state and thereafter extruding onto said cooled adhesive in a third treatment zone, a molten extrudable thermoplastic resin composition selected from a plasticized vinyl resin, a polyolefin, and a polyamide at a temperature sufficient to melt said adhesive and effect a bond between said adhesive and said resin;
- and thereafter in a fourth treatment zone reducing the temperature of said advancing coated substrate to solidify the bonded coating of adhesive and thermoplastic resin composition.
A process for applying and bonding a protective coating to a clean metallic substrate which comprises applying to a rapidly advancing length of said substrate a first ply of molten hydropholic hot melt adhesive composition composed of a non-thermosetting phenolic-modified terpene resin and ethylene vinyl acetate copolymer, cooling said adhesive composition to a soft, solid, flow-resistant state, extruding a molten extrudable thermoplastic resin composition selected from a vinyl resin, a polyolefin or polyamide on to said adhesive composition at a temperature sufficient to melt said adhesive composition and cooling whereby said thermoplastic resin composition is bonded to said substrate by means of said adhesive composition.
Dependencies are inferred from the claim text.