Non-phasing chloroprene polymer adhesive composition and preparation thereof
AssigneeDenki Kagaku Kogyo Kabushiki Kaisha
InventorsYasuaki Denda, Takashi Kadowaki, Michio Dohi
Life of this patent
Estimating the term…
Abstract
Chloroprene or a mixture of chloroprene and a comonomer is polymerized by emulsion polymerization in the presence of an alkali metal or ammonium salt of an aliphatic substituted benzoic acid or a non-ionic polyoxyethylene ether or ester surfactant. The resulting chloroprene polymer is admixed with a solvent, a metal oxide and a thermosettable resin, e.g., an alkylphenol-formaldehyde resin to yield a non-phasing adhesive composition.
Claims13
In a non-phasing chloroprene polymer adhesive composition comprising:
- a. 100 parts by weight of a chloroprene polymer;
- b. 1-50 parts by weight of a metal oxide;
- c. 5-100 parts by weight of an alkylphenol-formaldehyde resin,
- a, b and c being admixed with an organic solvent so as to obtain a solids content of said adhesive composition of from 5-60%;
- the improvement wherein said chloroprene polymer is prepared by the emulsion polymerization of chloroprene or a mixture of chloroprene and a comonomer in the presence of a salt of a C.sub.4 -C.sub.8 aliphatic substituted benzoic acid surfactant.
In the preparation of a non-phasing chloroprene polymer adhesive composition comprising:
- a. 100 parts by weight of a chloroprene polymer;
- b. 50 parts by weight of a metal oxide;
- c. 5-100 parts by weight of an alkyl phenol-formaldehyde resin;
- a, b, and c being mixed with an organic solvent so as to obtain a solids content of said adhesive composition of from 5 to 60%;
- the improvement wherein said chloroprene polymer is prepared by the emulsion polymerization of chloroprene or a mixture of chloroprene and a comonomer in the presence of a salt of a C.sub.4 -C.sub.8 aliphatic substituted benzoic acid surfactant.
Dependencies are inferred from the claim text.