Process of making wire connections in semi-conductor elements

In a process for the continuous production of at least one wire connection on a semi-conductor element, said process including preparing a wire piece, fusing a sphere onto both ends of said wire piece, and connecting the wire piece with heated contact locations on the semi-conductor element through thermal compression, the improvement comprising:

• providing a linear spare wire supported in a stationary tubular guide member and protruding therefrom with its leading end;
• gripping said protruding end and fusing-off a wire piece from the spare wire whilst concurrently fusing a sphere onto the fused-off ends of the wire piece and the spare wire;
• displacing the wire piece transversely to the longitudinal axis of the spare wire from its initial position into a first displaced position;
• embracing the spare wire in closely spaced relationship with forceps means between the tubular guide member and the sphere formed on the end of the spare wire;
• displacing both the forceps means and the wire piece in a direction along said axis for a predetermined distance, whereby upon displacement of the forceps means the sphere formed on the end of the spare wire contacts the forceps means and by continued displacement of the foreceps means is conveyed through motion of the spare wire into a predetermined position along said axis, and whereby the wire piece occupies a second displaced position;
• conveying the wire piece transversely to said axis towards a pressing tool, whereby the wire piece occupies a third displaced position;
• taking up the wire piece by the pressing tool;
• pressing both said spheres on the wire piece through actuation of the pressing tool onto said heated contact locations on the semi-conductor element;
• and concurrent with the pressing-on, gripping said protruding end of the spare wire adjacent said forceps means embracing the spare wire and fusing-off a subsequent wire piece from the spare wire.

In a process for the continuous production of at least one wire connection on a semi-conductor element, said process including preparing a wire piece, fusing a sphere onto both ends of said wire piece, and connectiing the wire piece with heated contact locations on the semi-conductor element through thermal compression, the improvement comprising:

• providing a linear spare wire supported in a tubular guide member and protruding therefrom with its leading end;
• gripping said protruding end and fusing-off a wire piece from the spare wire whilst concurrently fusing a sphere onto the fused-off ends of the wire piece and the spare wire;
• displacing the wire piece transversely to the longitudinal axis of the spare wire from its initial position into a first displaced position;
• displacing both the spare wire and the wire piece in a direction along said axis for a predetermined distance, whereby the wire piece occupies a second displaced position;
• conveying the wire piece transversely to said axis towards a pressing tool, whereby the wire piece occupies a third displaced position;
• taking up the wire piece by the pressing tool;
• pressing both said spheres on the wire piece through actuation of the pressing tool onto said heated contact locations on the semi-conductor element;
• and concurrent with the pressing-on, gripping said protruding end of the spare wire and fusing-off a subsequent wire piece from the spare wire.