Electrodeposition of copper

Abstract

This invention relates to novel compositions and to a process for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member independently selected from each of the following two groups: A. an aryl quaternary N-heteroaromatic or N-heteroaliphatic ring compound or salt exhibiting the structure: ##EQU1## WHEREIN R is selected from the group consisting of phenyl, benzyl and p-xylyl and the N-Ring is selected from the group consisting of substituted and unsubstituted N-heteroaliphatic rings and substituted and unsubstituted N-heteroaromatic rings; Y is present or absent; Y, when present, represents an anionic moiety, n is 1 save when R is p-xylyl n is 2; B. sulfoalkyl sulfide compounds containing the grouping --S--Alk--SO.sub.3 M where M is one gram-equivalent of a cation and --Alk-- is a divalent aliphatic hydrocarbon group of 1 to 8 carbon atoms.

Dependencies are inferred from the claim text.