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US 3,940,290 AGranted
Process for preparing copper base alloys
AssigneeOlin Corporation
InventorsMichael J. Pryor, Jacob Crane, Sam Friedman, Eugene Shapiro
Life of this patent
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Abstract
Improved properties are obtained in copper alloys containing from 7 to 14% nickel, from 1.5 to 3.3% tin, plus iron and/or cobalt in an amount from 0.1 to 3% each, by hot rolling, cold rolling, annealing and cold rolling, all under defined conditions. The resultant alloys are characterized by good strength, good bend properties, good solderability and low contact resistance.
Claims10
A process for preparing wrought copper base alloys having good strength and bend characteristics, good solderability and low contact resistance which comprises:
- A. providing a copper base alloy consisting essentially of from 7 to 14% nickel, from 1.5 to 3.3% tin with the minimum nickel plus tin content being 9.5%, a material selected from the group consisting of iron from 0.1 to 3%, cobalt from 0.1 to 3% and mixtures thereof wherein the minimum iron plus cobalt content in the alloy is 1.0%, balance copper;
- B. hot rolling said alloy with a finishing temperature in excess of 550.degree.C;
- C. cold rolling said alloy with a cold reduction of at least 20%;
- D. annealing said alloy at a temperature of from 300.degree. to 850.degree.C for at least 1 minute;
- E. cold rolling the alloy with a reduction of at least 20%;
- F. aging at a temperature of from 300.degree. to 550.degree.C for from 15 minutes to 24 hours;
- and
- G. cold rolling the alloy with a reduction of from 20 to 55%,
- thereby providing a wrought copper base alloy having a fine grain size below 0.025 mm and characterized by the presence of a fine, dispersed magnetic phase containing said material selected from the group consisting of iron, cobalt and mixtures thereof.
6 more elements
Dependencies are inferred from the claim text.