Bonding of ferrite to metal for high-power microwave applications
AssigneeVarian Associates, Inc.
InventorsVictor A. Vaguine, Dennis R. Nichols
Life of this patent
Estimating the term…
Abstract
A ferrite-to-metal bond suitable for the environment of a high-power microwave circulator is disclosed. The bonding surface of a gyromagnetic ferrite or garnet button is metallized by a sputtering process that deposits successive layers of nichrome, copper and gold thereon. During the sputtering process, a flexible stainless steel band surrounds the button to prevent sputtered material from being deposited on other than the bonding surface of the button. The metallized bonding surface is then soldered to a metal wall of the circulator. The bond so formed is capable of withstanding a peak power level in the circulator of 2.0 megawatts and an average power level of 3.5 kilowatts under standing-wave conditions.
Claims11
A method of bonding a gyromagnetic ferrite button for causing nonreciprocal transmission of power within a microwave circulator to a metal wall of said circulator, said method comprising the steps of depositing a plurality of metal layers in succession upon a portion of said button and then soldering said metallized button to said metal wall.
A method of bonding a button for causing non-reciprocal transmission of power within a microwave circulator to a metal wall of said circulator, said method comprising the steps of masking a portion of the side surface of said button, sputter depositing a plurality of metal layers in succession upon the bonding surface of said button to metallize said portion of said button, and then soldering said metallized button to said metal wall.
Dependencies are inferred from the claim text.