Method of forming an electrical network package

The method of joining a substrate with a superstrate, said substrate bearing a network of electric circuit elements on one face, to form a package in which the network is substantially sealed, comprising the sequential steps of:

• emplacing a B-stage thermosetting adhesive material on said substrate face,
• heating said substrate and adhesive material sufficiently to initiate the formation of said adhesive material into a gel at a temperature less than the temperature necessary to substantially alter the electrical characteristics of said circuit elements,
• momentarily compressing said adhesive material between said substrate and a superstrate sufficiently to flow said adhesive material into sealing relation with electric circuit elements and inhibit relative slippage between said substrate and superstrate,
• releasing said compression, and
• heating the resulting package to substantially cure said adhesive material subsequent to releasing of said compression.

The method of forming an electrical network package, comprising the sequential steps of:

• depositing a network of electric circuit elements on a face of a substrate,
• connecting electrical termination means to said network with the termination means extending outwardly from the substrate,
• positioning a B-stage thermosetting adhesive material on said substrate face,
• positioning a superstrate on said adhesive material,
• heating said adhesive material sufficiently to initiate the formation of said adhesive material into a gel,
• compressing said substrate and superstrate together against said adhesive material sufficiently to inhibit relative slippage therebetween,
• releasing said compression, and
• heating the resulting network package to substantially cure said adhesive material subsequent to releasing of said compression.