Apparatus for cleaning thin, fragile wafers of a material

Apparatus for simultaneously cleaning the surfaces of a number of thin, disc-like wafers being moved in a linear path comprising, in combination:

• at least one pair of endless belts defining the linear path of movement for the wafers, one belt being arranged relative to the other with the facing portions of the belts being spaced apart by at least the diameter of the wafers interposed therebetween so as to frictionally engage the peripheral edges thereof for simultaneously moving and rotating the wafers in one direction along the path;
• a plurality of abrading members rotatably mounted on each side of the path for engaging and cleaning the respective surfaces of the wafers, the abrading members being arranged in pairs along the path and each pair comprising an abrading member on each respective side of the path;
• and
• drive means operatively coupled to the belts for moving one belt at a faster rate than the other for imparting rotary motion to the wafers in a direction corresponding to that of the faster moving belt and to the abrading members for rotating the same, the abrading members comprising a pair being rotated in opposite directions, the rotary forces applied to surfaces of the wafers by each pair of abrading members being nullified to the extent that rotation of the wafers in the one direction and movement along the path by the belts is not inhibited.