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US 3,939,029 AGranted
Method of bonding utilizing a heat activated polyamide adhesive
AssigneeThe Standard Oil Company
InventorsKenneth D. Gilliam, Carl Serres
Life of this patent
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Abstract
High strength structural metal-to-metal bonds can be achieved in 10 to 15 seconds by placing a resinous polyamide capable of imidizing between the metal surfaces to be bonded and heating the composite to a temperature sufficiently high (.gtoreq. 400.degree.F) to induce imidization.
Claims10
A method of adhering surfaces comprising the steps of:
- a. placing between the surfaces to be bonded a resinous polyamide having an inherent viscosity greater than 0.2 and containing an aliphatic or cycloaliphatic diamine residue of up to about 20 carbon atoms copolymerized with a carboxylic aromatic acid residue having 3 carboxyl groups wherein two of said carboxyl groups are linked to said diamine residue through amide bonds and wherein the remaining unreacted carboxyl groups is in either the acid or ester form attached to a carbon atom which is adjacent to a second carbon atom of the same aromatic ring containing one of the carboxyl groups involved in said amide bond such that said unreacted carboxyl group can imidize with said amide bond,
- b. heating the surfaces and polyamide such as to induce imidization, and
- c. cooling the bonded surfaces.
A method of adhering surfaces comprising the steps of:
- a. placing a resinous polyamide made by polymerizing 4-chloroformylphthalic anhydride with 1,6-hexanediamine having essentially the formula:
- ##SPC1##
- where n is an integer representing the number of repeating units which characterizes a polymer having an inherent viscosity greater than 0.2, between the surfaces to be bonded;
- b. heat activating the surfaces and polyamide under a compressive force at a temperature above 400.degree.F. for at least 10 seconds;
- and
- c. cooling the bonded surfaces.
3 more elements
Dependencies are inferred from the claim text.