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US 2026/0314501 A1Published application
Memory devices and microelectronic device packages including wirebonding and related methods
OwnerAkanksha Sahooinventor
Life of this patent
Estimating the term…
Abstract
A memory device may include a carrier including a connection region and a routing region positioned at an angle relative to the connection region. The memory device may further include a wire bond coupled between at least one microelectronic device and the routing region of the carrier. The memory device may also include a support structure positioned adjacent the routing region on a side of the routing region opposite the at least one microelectronic device.
Claims20
A memory device comprising:
- a carrier comprising a routing region and a connection region;
- a stack of microelectronic devices positioned adjacent to the carrier and over the connection region, the stack of microelectronic devices including a first sub-stack of microelectronic devices and a second sub-stack of microelectronic devices;
- first wire bonds coupling a first microelectronic device of the first sub-stack to the routing region of the carrier, the first wire bonds having a first length;
- and
- second wire bonds coupling a second microelectronic device of the second sub-stack to the routing region, the second wire bonds having a second length substantially the same as the first length of the first wire bonds.
2 more elements
A method of forming a microelectronic device, the method comprising:
- forming a carrier including a routing region and a connecting region;
- bending a portion of the carrier including the routing region relative to a portion of the carrier including the connecting region;
- coupling at least one microelectronic device to the connecting region of the carrier;
- attaching a wire bond to a wire bonding region of the at least one microelectronic device with a tooling structure;
- rotating the carrier to a position where the routing region is in a plane perpendicular to the tooling structure;
- and
- attaching the wire bond to the routing region of the carrier with the tooling structure.
4 more elements
A microelectronic device package comprising:
- a carrier comprising a connection region and a routing region;
- a first microelectronic device adjacent to the carrier;
- a first wire bond coupled between the first microelectronic device and the routing region of the carrier, the first wire bond having a first length;
- a second microelectronic device vertically adjacent to the first microelectronic device;
- and
- a second wire bond coupled between the second microelectronic device and the routing region of the carrier, the second wire bond having a second length substantially the same as the first length of the first wire bond.
3 more elements
Dependencies are inferred from the claim text.