Integrated passive device and method for manufacturing the same, electronic apparatus

Abstract

The present disclosure provides an integrated passive device, a method for manufacturing the same, and an electronic apparatus, and belongs to the technical field of passive devices. The integrated passive device includes a dielectric substrate, at least two conductive layers on the dielectric substrate, and an interlayer dielectric layer between any two adjacent conductive layers; one of any two adjacent conductive layers close to the dielectric substrate is a first conductive layer, and the other one of the any two adjacent conductive layers is a second conductive layer; the first conductive layer includes a first conductive structure, and the second conductive layer includes a second conductive structure; the second conductive structure and the first conductive structure are electrically connected to each other through a connection hole penetrating through at least the interlayer dielectric layer between the second conductive structure and the first conductive structure.

Dependencies are inferred from the claim text.