Stacked optoelectronic µ-ic device

An optoelectronic device comprising:

• a first integrated circuit comprising first contact pads configured for electrically contacting and/or operating the optoelectronic device and second contact pads;
• a second integrated circuit arranged on the first integrated circuit comprising at least third contact pads electrically coupled to at least some of the second contact pads;
• and
• an optoelectronic component arranged on the first or second integrated circuit and being electrically coupled to the first or second integrated circuit,
• wherein the first integrated circuit comprises a first functionality configured for operating the optoelectronic component and the second integrated circuit comprises a second functionality configured for operating the optoelectronic component.

A method for manufacturing an optoelectronic device, the method comprising:

• providing a first integrated circuit substrate;
• processing the integrated circuit substrate to comprise an at least first integrated circuit;
• providing first and second contact pads on the at least first integrated circuit;
• providing a second integrated circuit on the at least first integrated circuit comprising third contact pads electrically coupled to at least some of the second contact pads;
• and
• providing an optoelectronic component on the at least first integrated circuit or the second intergraded circuit and electrically coupled to the first or second intergraded circuit,
• wherein the first integrated circuit comprises a first functionality for operating the optoelectronic component and the second integrated circuit comprises a second functionality for operating the optoelectronic component.