Optoelectronic semiconductor device and method for producing an optoelectronic semiconductor device
Assigneeams-OSRAM International GmbH
InventorsPeter Blum, Michael Zitzlsperger
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Abstract
In an embodiment an optoelectronic semiconductor device includes an optoelectronic semiconductor chip arranged in at least one cavity of a housing and configured to emit electromagnetic radiation and an insert, wherein the cavity comprises at least one side surface at least partially laterally surrounding the optoelectronic semiconductor chip, wherein the insert is arranged between the optoelectronic semiconductor chip and the side surface at a distance from the optoelectronic semiconductor chip, and wherein the distance between the insert and the optoelectronic semiconductor chip is at most 250 μm.
Claims18
-17. (canceled)
An optoelectronic semiconductor device comprising:
- an optoelectronic semiconductor chip arranged in at least one cavity of a housing and configured to emit electromagnetic radiation;
- and
- an insert,
- wherein the cavity comprises at least one side surface at least partially laterally surrounding the optoelectronic semiconductor chip,
- wherein the insert is arranged between the optoelectronic semiconductor chip and the side surface at a distance from the optoelectronic semiconductor chip, and
- wherein the distance between the insert and the optoelectronic semiconductor chip is at most 250 μm.
A method for producing an optoelectronic semiconductor device, the method comprising:
- providing a housing with a plurality of cavities;
- arranging an optoelectronic semiconductor chip in each cavity such that side surfaces of a respective cavity at least partially surround the optoelectronic semiconductor chip;
- and
- arranging at least one insert between the optoelectronic semiconductor chip and the side surface of a respective cavity at a distance from the optoelectronic semiconductor chip such that the distance between the insert and the optoelectronic semiconductor chip is at most 250 μm.
An optoelectronic semiconductor device comprising:
- an optoelectronic semiconductor chip arranged in at least one cavity of a housing and configured to emit electromagnetic radiation;
- and
- an insert,
- wherein the cavity comprises at least one side surface at least partially laterally surrounding the optoelectronic semiconductor chip, and
- wherein the insert is arranged between the optoelectronic semiconductor chip and the side surface at a distance from the optoelectronic semiconductor chip.
Dependencies are inferred from the claim text.