Protection laminate with integrated electrical contact element for coating and electrically conductive contacting a semifinished electronic product
AssigneeHeliatek GmbH
InventorsMartin HERMENAU, Christian KIRCHHOF
Life of this patent
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Abstract
A protection laminate with at least one integrated electrical contact element for coating and electrically conductive contacting a semifinished electronic product, a method for manufacturing such protection laminate with at least one integrated electrical contact element, a method for coating and electrically conductive contacting a semifinished electronic component with such protection laminate comprising at least one integrated electrical contact element, and a use of such protection laminate with at least one integrated electrical contact element for coating and electrically conductive contacting a semifinished electronic component.
Claims21
A protection laminate with at least one integrated electrical contact element, preferably at least one busbar, for coating and electrically conductive contacting a semifinished electronic product, the protection laminate comprising at least one protection layer with a top side and a bottom side, on the bottom side of the at least one protection layer a non-conductive adhesive layer, at least one electrical contact element embedded into the non-conductive adhesive layer, wherein a bottom side of the at least one electrical contact element is at least partially not covered by the non-conductive adhesive layer, wherein a conductive adhesive is arranged on the bottom side of the at least one electrical contact element, and a release liner covering the non-conductive adhesive layer and the conductive adhesive on a side opposite to the at least one protection layer, and wherein the adhesive strength of the non-conductive adhesive layer and the conductive adhesive is in the same range.
A method for manufacturing a protection laminate with at least one integrated electrical contact element (11), preferably at least one busbar, for coating and electrically conductive contacting a semifinished electronic product, the protection laminate comprising at least one protection layer with a top side and a bottom side, on the bottom side of the at least one protection layer a non-conductive adhesive layer, at least one electrical contact element embedded into the non-conductive adhesive layer, wherein a bottom side of the at least one electrical contact element is at least partially not covered by the non-conductive adhesive layer, wherein a conductive adhesive is arranged on the bottom side of the at least one electrical contact element, and a release liner covering the non-conductive adhesive layer and the conductive adhesive on a side opposite to the at least one protection layer, and wherein the adhesive strength of the non-conductive adhesive layer and the conductive adhesive is in the same range, comprising the following steps:
- a) providing a release liner;
- b) laminating the at least one electrical contact element, preferably at least one busbar, on the top side of the release liner, wherein a conductive adhesive is applied on the bottom side of the at least one electrical contact element or on a region on the top side of the release liner on which the at least one electrical contact element is applied;
- c) providing at least one protection layer;
- d) applying a non-conductive adhesive layer on the bottom side of the at least one protection layer and/or on the top side of the release liner with the at least one electrical contact element of step b);
- e) laminating the release liner with the at least one electrical contact element of step b) by its top side and the at least one protection layer with the non-conductive adhesive layer of step d) by its bottom side;
- and,
- f) obtaining the protection laminate with at least one integrated electrical contact element.
Dependencies are inferred from the claim text.