Preparation Method for Quantum Chip, Quantum Chip, and Quantum Computer

Abstract

This application discloses a method for preparing a quantum chip, a quantum chip, and a quantum computer, related to the technical field of quantum chips. The method includes: spin-coating a positive photoresist on a substrate, and preparing an under bump metallization (UBM) layer and an air bridge on the substrate spin-coated with the positive photoresist, to obtain a first substrate structure; spin-coating a negative photoresist on the first substrate structure, and preparing a metal column solder joint on the first substrate structure spin-coated with the negative photoresist, to obtain a second substrate structure; and removing the positive photoresist and the negative photoresist from the second substrate structure, to obtain a quantum chip including the UBM layer, the air bridge, and the metal column solder joint. By using the method provided in exemplary embodiments of this application, preparation efficiency can be improved, and performance of the chip can be improved.

Dependencies are inferred from the claim text.