Asymmetrical Power Sharing

A method, comprising:

• accessing, by a first integrated circuit die, information identifying a power budget of a first power source that is configured to supply power to the first integrated circuit die and a second integrated circuit die but that is not coupled to supply power to one or more intervening integrated circuit dies that couple the first integrated circuit die to the second integrated circuit die, wherein power is obtainable from the first power source based on a first plurality of power credits included in the power budget;
• allocating, by the first integrated circuit die, a first set of the first plurality of power credits to a set of component circuits of the first integrated circuit die;
• and
• sending, by the first integrated circuit die, a second set of the first plurality of power credits to the second integrated circuit die through a path that includes the one or more intervening integrated circuit dies without the one or more intervening integrated circuit dies using the second set of power credits to obtain power from the first power source, wherein the one or more intervening integrated circuit dies are configured to obtain power from a second power source.

An apparatus, comprising:

• a plurality of circuits of a computer system implemented on a plurality of integrated circuit dies, wherein a first one of the plurality of co-packaged integrated circuit dies is indirectly coupled to a second one of the plurality of co-packaged integrated circuit dies through a path that includes one or more intervening integrated circuit dies;
• a first power source that is configured to supply power to the first and second integrated circuit dies but that is not coupled to supply power to the one or more intervening integrated circuit dies;
• and
• a second power source that is configured to supply power to the one or more intervening integrated circuit dies;
• wherein the first integrated circuit die is configured to:
• allocate, to a set of component circuits of the first integrated circuit die, a first set of a first plurality of power credits allocated for the first power source, wherein the set of component circuits is configured to obtain power from the first power source based on the first set of power credits;
• and
• transmit, to the second integrated circuit die through the path, a second set of the first plurality of power credits, wherein the second integrated circuit die is configured to obtain power from the first power source based on the second set of power credits;
• wherein the one or more intervening integrated circuit dies are configured to obtain power from the second power source based on a second plurality of power credits allocated for the second power source that are distinct from the first plurality of power credits allocated for the first power source.