US 2026/0310105 A1Published application

Precise, High Throughput Optical Imaging Of Packaged Devices

OwnerTal Goichman, Ashkan Aghajani +1inventors

InventorsTal Goichman, Ashkan Aghajani, Arkady Bronfman

Life of this patent

Estimating the term…

Loading patent…

Abstract

Methods and systems for high precision, high throughput, three-dimensional imaging of packaged devices with a small equipment footprint is described herein. In preferred embodiments, a three dimensional imaging system is integrated with additional equipment stations to perform other inspection and metrology applications within a shared equipment footprint. In one aspect, a packaged device measurement system includes a three dimensional imaging system including an optical imaging subsystem, and a sample positioning subsystem mounted to a stiff, massive, vertically oriented, perimeter frame structure. The stiffness and mass of the frame minimizes relative movement of the optical elements of the optical imaging subsystem with respect to the sample under measurement despite force disturbances imposed on the packaged device measurement system from surrounding equipment and rapid movements of the imaging and sample positioning subsystems.

Claims20

Dependent claims

A packaged device measurement system, comprising:

a vertically oriented, perimeter frame including a bottom structural element extending in a first direction, a top structural element extending in the first direction and offset from the bottom structural element in a second direction perpendicular to the first direction, a first upright structural element extending in the second direction from the bottom structural element to the top structural element at a first end of the top and bottom structural elements, and a second upright structural element extending in the second direction from the bottom structural element to the top structural element at a second end of the top and bottom structural elements opposite the first end;
an optical imaging subsystem including an illuminator and a detector configured to generate a set of images of a packaged device, each image of the set of images focused at a different depth of the packaged device;
and
a sample positioning subsystem mechanically coupled to the bottom structural element of the vertically oriented, perimeter frame, the sample positioning subsystem disposed between the bottom structural element and the top structural element and between the first and second upright structural elements, the sample positioning subsystem including a linear motion stage configured to move a tray including the packaged device with respect to the optical imaging subsystem in the first direction and in a third direction orthogonal to the first and second directions.

1 more element

A packaged device measurement system, comprising:

a vertically oriented, perimeter frame including a bottom structural element, a top structural element a first upright structural element, and a second upright structural element;
a sample positioning subsystem mechanically coupled to the bottom structural element and disposed between the bottom structural element and the top structural element and between the first and second upright structural elements, the sample positioning subsystem including a linear motion stage configured to move a tray including a packaged device with respect to the vertically oriented, perimeter frame in a first direction and a second direction orthogonal to the first direction;
and
an optical imaging subsystem including an illuminator and a detector configured to generate a set of images of a packaged device, each image of the set of images focused at different depths of the packaged device, the different depths extending in a third direction orthogonal to the first and second directions, wherein a stiffness of a structural connection between an equipment table of the packaged device measurement system and the vertically oriented, perimeter frame is lower than a structural stiffness of the top structural element with respect to the bottom structural element.

1 more element

Dependencies are inferred from the claim text.