Semiconductor devices with photonic interconnect platforms that include multiple photonic integrated circuits

A device comprising:

• a photonic circuit layer comprising:
• a plurality of photonic integrated circuits (PICs) comprising a first PIC, a second PIC, and a third PIC, wherein the second PIC is disposed between the first PIC and the third PIC, and wherein the first PIC comprises one or more optical couplers;
• and
• waveguides arranged in the first PIC, the second PIC, and the third PIC;
• an electronic circuit layer comprising electronic integrated circuits (EICs) attached to the photonic circuit layer, wherein each EIC comprises a plurality of computing components;
• a plurality of electro-optical transceivers arranged in the electronic circuit layer and the photonic circuit layer, each electro-optical transceiver comprising an optical portion in the photonic circuit layer and a corresponding electrical portion in the electronic circuit layer,
• wherein the waveguides comprise:
• a plurality of local waveguides, wherein each local waveguide is routed within one of the plurality of PICs, wherein a first local waveguide optically couples a first optical coupler of the one or more optical couplers with a first electro-optical transceiver of the plurality of electro-optical transceivers, and wherein the optical portion of the first electro-optical transceiver is arranged in the first PIC;
• and
• a plurality of boundary-crossing waveguides that each extend across a boundary between adjacent PICs, wherein each boundary-crossing waveguide comprises an optical connection at the boundary, wherein each optical connection has a width larger than a width of the waveguide away from the boundary, and wherein a first boundary-crossing waveguide optically couples the first optical coupler with a second electro-optical transceiver for which the optical portion is arranged in the third PIC.