Current sensing capabilities for power semiconductor devices

A semiconductor device package comprising:

• at least one semiconductor device;
• and
• a plurality of connectors to connect the at least one semiconductor device to circuitry external to the at least one semiconductor device, wherein the plurality of connectors include:
• a first connector connected to a first portion of the at least one semiconductor device, the first connector to output a voltage of the first portion of the at least one semiconductor device;
• and
• a second connector connected to a second portion of the at least one semiconductor device, the second connector to output a voltage of the second portion of the at least one semiconductor device, wherein relative magnitudes of the voltage of the first portion and the voltage of the second portion are indicative of relative currents through the first portion and the second portion.

A method comprising:

• sensing, through a first external connector of at least one semiconductor device package, a voltage on a first current path including a first semiconductor device of the at least one semiconductor device package;
• sensing, through a second external connector of the at least one semiconductor device package, a voltage on a second current path including a second semiconductor device of the at least one semiconductor device package;
• and
• detecting that a magnitude of current through the first current path is different from a magnitude of current through the second current path based on the voltage on the first current path and the voltage on the second current path.