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US 2026/0309663 A1Published application
Sensor module and method for manufacturing a sensor module
OwnerChing-Yu Yuan, Frederik Willem Maurits Vanhelmont +1inventors
InventorsChing-Yu Yuan, Frederik Willem Maurits Vanhelmont, Casper Van Der Avoort
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Abstract
In an embodiment a sensor module includes a connection carrier, a sensor arranged on the connection carrier, a sensor cap surrounding the connection carrier and/or the sensor at least partially, an insert surrounding the sensor, the insert leaving an access opening of the sensor freely accessible, wherein the insert includes an elastic material.
Claims15
-14. (canceled)
A sensor module comprising:
- a connection carrier;
- a sensor arranged on the connection carrier;
- a sensor cap surrounding the connection carrier and/or the sensor at least partially;
- and
- an insert surrounding the sensor, the insert leaving an access opening of the sensor freely accessible,
- wherein the insert comprises or consists of an elastic material.
3 more elements
A method for manufacturing a sensor module, the method comprising:
- providing a connection carrier;
- arranging a sensor on the connection carrier;
- arranging a sensor cap over the sensor such that the sensor cap surrounds the connection carrier at least partially;
- and
- arranging an insert such that the insert surrounds the sensor, the insert leaving an access opening of the sensor freely accessible,
- wherein the insert comprises or consists of an elastic material.
3 more elements
Dependencies are inferred from the claim text.