Back to results
US 2026/0309598 A1Published application
Systems and methods for determining compaction of a thin film based on impedance
AssigneeUniversity of Southern California
InventorsWeijian Ding, Amy Childress, Kexin Ma
Life of this patent
Estimating the term…
Abstract
Disclosed herein are devices, methods, and systems to quantify the compaction of thin films.
Claims19
A system for determining compaction of a thin film material based on measured impedance across the thin film, comprising:
- a force application and measurement device, wherein force is applied to the thin film by a force application and measurement device;
- and
- an impedance meter connected to two electrodes, with each of the electrodes located on opposite sides of the thin film,
- wherein the force application and measurement device applies a precisely controlled force to the thin film, and the impedance meter detects an impedance at a set frequency which fits the materials' electrochemical properties.
1 more element
A method of determining a correlation between compaction and measured impedance across a thin film, comprising:
- a. measuring impedance from one side of the thin film to an opposite side of the thin film in an un-compacted state;
- b. applying a force to the thin film to compact the thin film;
- c. measuring an impedance of the compacted thin film;
- d. repeating a.-c. a plurality of times, wherein compaction of the thin film is correlated with the measured impedance;
- and
- e. creating a table that correlates the measured impedance with a compaction value such that measured impedance across the thin film can be correlated with a level of compaction such that measured impedance across the thin film can be correlated with a level of compaction.
3 more elements
A system for monitoring compaction of a thin film, comprising:
- an impedance meter connected to at least two electrodes, with each of the electrodes located on opposite sides of the thin film;
- and
- a computing device comprising at least one or more processors and a memory, wherein the computing device is in communication with the impedance meter and where a table is stored in the memory, said table correlating impedance values with compaction, wherein said computing device;
- receives an impedance value from the impedance meter, said impedance value indicating a real-time value of impedance across the thin film, and
- determines a real-time compaction value of the thin film based on the impedance value received from the impedance meter and the table stored in the memory.
2 more elements
A method for monitoring compaction of a thin film, comprising:
- receiving an impedance value, said impedance value indicating a real-time value of impedance across the thin film, and
- determining a real-time compaction value of the thin film based on the received impedance value received from the impedance meter and a table correlating impedance values with compaction.
Dependencies are inferred from the claim text.