Heat dissipation apparatus

Abstract

A heat dissipation apparatus according to the present invention comprises: a first-side heat-conducting panel provided as a metal panel member; a second-side heat-conducting panel provided as a metal panel member and forming, together with the first-side heat-conducting panel, a refrigerant flow space in which a refrigerant undergoes a phase change and flows; and a bonding medium frame body provided to mediate bonding of edge portions of the first-side heat-conducting panel and the second-side heat-conducting panel, and thus the present invention maximizes heat dissipation performance and greatly enhances product productivity.

Dependencies are inferred from the claim text.