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US 2026/0309319 A1Published application
Composite printed circuit board apparatus
AssigneeWhelen Engineering Company, Inc.
InventorDavid J. Sousa
Life of this patent
Estimating the term…
Abstract
An apparatus includes a single-layer metal core printed circuit board (PCB) and a multi-layer power PCB. The single-layer metal core PCB is connected to the multi-layer power PCB via one or more soldering joints and one or more connecting elements. The single-layer metal core PCB includes one or more light emitting diodes (LEDs) that, once connected with the multi-layer power PCB, are operated by an electrical signal.
Claims20
A composite circuit assembly, comprising:
- a multi-layer power printed circuit board (PCB) comprising a first top side and a first bottom side, the multi-layer power PCB further comprising:
- a switching current regulator to provide power conversion, the switching current regulator comprising an integrated power supply controller, a power inductor, and a switching field-effect transistor (FET);
- and
- one or more first soldering pads on the first bottom side;
- and
- a single-layer metal core PCB comprising a second top side and a second bottom side, the single-layer metal core PCB further comprising:
- one or more light-emitting diodes mounted on the second top side;
- one or more second soldering pads on the second top side, further to align with the first soldering pads on the first bottom side of the multi-layer power PCB;
- and
- one or more connecting elections to connect the multi-layer power PCB to the single-layer metal core PCB.
7 more elements
A method for dissipating heat, comprising:
- providing a single-layer metal core printed circuit board (PCB) comprising a first top side and first bottom side, the single-layer metal core PCB further comprising one or more light-emitting diodes (LEDs) mounted on the first top side and one or more thermal pads on the first top side;
- providing a multi-layer power PCB comprising a second top side and a second bottom side, the multi-layer power PCB further comprising one or more thermal pads on the second bottom side;
- and
- thermally coupling the single-layer metal core PCB to the multi-layer power PCB by heating the thermal pads.
1 more element
A composite apparatus, comprising:
- a single-layer metal core printed circuit board (PCB) comprising a top side and a bottom side, the single-layer metal core PCB further comprising one or more light-emitting diodes (LEDs) mounted on the top side;
- and
- a multi-layer power PCB mounted on the top side of the single-layer metal core PCB, the multi-layer power PCB comprising one or more heat generating elements;
- wherein the multi-layer power PCB is mounted to the single-layer metal core PCB via one or more thermal pads comprising soldering elements.
1 more element
Dependencies are inferred from the claim text.