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US 2026/0308426 A1Published application
Heat-curing epoxy resin composition suitable for low curing temperature with good storage stability
AssigneeSika Technology AG
InventorsChristian KRÜGER, Cornelia BÖFER
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Abstract
Thermosetting epoxy resin compositions including an epoxy resin, a dihydrazide curing agent and a specific terminally blocked polyurethane prepolymer as a toughening agent. The compositions feature good mechanical properties and storage stability and a low curing temperature. The epoxy resin compositions are especially suitable for use as bodywork adhesive.
Claims15
A thermosetting one-component epoxy resin composition comprising
- a) at least one epoxy resin A having an average of more than one epoxy group per molecule;
- b) at least one curing agent B for epoxy resins, where the curing agent B is a dihydrazide;
- and
- c) at least one toughness improver D that is a terminally blocked polyurethane prepolymer of the formula (I):
- where R1 is a p-valent radical of a linear or branched polyurethane prepolymer terminated by isocyanate groups after the removal of the terminal isocyanate groups;
- p has a value of 2 to 8;
- and
- R2 is a blocking group which is detached at a temperature above 100° C., wherein R2 is not a substituent selected from the group consisting of cardanol after removal of the OH proton,
- where
- R3 and R4 are each independently H or an alkyl group or an aryl group or an aralkyl group.
7 more elements
Dependencies are inferred from the claim text.